Electronic Component Storage Requirements

Component obsolescence due to rapid changes in packaging design and material companies find themselves forced.

Electronic component storage requirements.

As an aerospace defense oem we have the same requirements and have implemented lts long term storage protocols to deal with it. Escc 24900 minimum requirements for controlling environmental contamination of components. Moisture sensitive component storage hiro suganuma alvin tamanaha seika machinery inc. 0 3 2 active components including semiconductors oscillators and diodes etc.

This document outlines the transportation packaging storage and environmental requirements for all electronic components manufactured by aimtec inc. Escc 20600 preservation packaging and dispatch of escc electronic components. Proper packaging is critical to the successful transportation of any electronic component be it moved inner city or. At that time this problem was recognized as having important logistics connotations.

The primary areas of enhancement were to the long term storage control requirements and the appendixes with guidelines for executing these requirements. Following are the risks that require mitigation for electronic components. Long term storage of components subassemblies and devices published by. Oxidation of lead finishes destroys solderability.

Transportation and storage of electronic components. 49 69 6302 276 fax. His focus has been the design and application of measurement tools used to improve manufacturing thermal processes and well as moisture sensitive component storage solutions. The storage of moisture sensitive electronic components and materials is problematic and manufacturers with long term storage require ments face additional obstacles.

He has seen and worked with the electronic manufacturing industry from many points of view including. 49 69 6302 407 e mail. However msds present a number of challenges when used in surface mount assembly as they may suffer. The problem of storage of electronic parts and equipment first came into focus with the publication of the agree committee report on task 8 in 1957.

Imc intermetallic compound growth through to the surface destroys solderability. Component shelf life storage condition requirements for electronic suppliers uncontrolled when printed ge proprietary or page 5 of 9 transmitted electronically ga src 0003 rev. Requirements for long term storage are in creasing. For logistics planning it was necessary to know what would be the failure rate of components and equipments when they were on the shelf for a long.

Updating of the storage level protection was clarified to improve the decision flow to which primarily electronic devices are to be stored. Can be accepted if less than 2 two years old ii.